On Fri, 13 Jan 2006 13:47:49 -0600, "DrDeath"
wrote:

+"james" wrote in message
...
+ On Mon, 9 Jan 2006 00:34:33 -0600, "DrDeath"
+ wrote:
+
++"Clark" wrote in message
...
++ How many of you have rushed out to get one of the Cold/Heat soldering
++ irons.
++ Runs off of 4 AA batteries WOW! allot of energy in those babies, most
++ likely
++ good for one PL259 soldering job.
++
++
++
++They show them soldering an IC. I don't think the IC would like that.
++
+ ********
+
+ Most ICs are tolerent to 400 degrees celsius for up to 10 seconds when
+ heat is applied to the pin. In IR assited reflow ovens, most
+ components on the board are subject to 275 degree C heat upwards of 45
+ to 90 seconds. Total reflow process time for surface mounted
+ components in a reflow oven is between 5 and 7 minutes. Most of that
+ will determine the pallete material that act as carrier for the PCBs.
+
+ FR4/5 laminate material will withstand heat around 300 degrees C for 7
+ to 10 minutes without discoloration or delamination.
+
+
+ james
+
+
+I haven't had a chance to see one in person. But from the commercial, it
+appears to look like an arc. That can't be good for sensitive electronics. I
+think I'll stick to my Hakko or my butane until I've had a chance to use
+one.
+
*****

No it is not an arc. One possibility is a conductive ceraminc alloy.
That would at least explain the rapid heat and cool down periods.
There are ceramics that can conduct and dissapate heat rather rapidly.

As for the Hakko, the hot air Hakko reflow units are real good for
surface mount devices. The only other item that I found better for
large ICs, 208 pin TQFPs is a hot plate.


james