On Sat, 14 Jan 2006 18:51:25 GMT, Lancer wrote:

+On Sat, 14 Jan 2006 17:12:48 GMT, james wrote:
+
+On Fri, 13 Jan 2006 13:47:49 -0600, "DrDeath"
wrote:
+
++"james" wrote in message
++news:dfucs1ptthup70hipg899p0rfmdjkqcf8g@4ax .com...
++ On Mon, 9 Jan 2006 00:34:33 -0600, "DrDeath"
++ wrote:
++
+++"Clark" wrote in message
...
+++ How many of you have rushed out to get one of the Cold/Heat soldering
+++ irons.
+++ Runs off of 4 AA batteries WOW! allot of energy in those babies, most
+++ likely
+++ good for one PL259 soldering job.
+++
+++
+++
+++They show them soldering an IC. I don't think the IC would like that.
+++
++ ********
++
++ Most ICs are tolerent to 400 degrees celsius for up to 10 seconds when
++ heat is applied to the pin. In IR assited reflow ovens, most
++ components on the board are subject to 275 degree C heat upwards of 45
++ to 90 seconds. Total reflow process time for surface mounted
++ components in a reflow oven is between 5 and 7 minutes. Most of that
++ will determine the pallete material that act as carrier for the PCBs.
++
++ FR4/5 laminate material will withstand heat around 300 degrees C for 7
++ to 10 minutes without discoloration or delamination.
++
++
++ james
++
++
++I haven't had a chance to see one in person. But from the commercial, it
++appears to look like an arc. That can't be good for sensitive electronics. I
++think I'll stick to my Hakko or my butane until I've had a chance to use
++one.
++
+*****
+
+No it is not an arc. One possibility is a conductive ceraminc alloy.
+That would at least explain the rapid heat and cool down periods.
+There are ceramics that can conduct and dissapate heat rather rapidly.
+
+Yes it is an arc, I have one.
+
+
+As for the Hakko, the hot air Hakko reflow units are real good for
+surface mount devices. The only other item that I found better for
+large ICs, 208 pin TQFPs is a hot plate.
+
+
+james
+
+Even with a hot plate, you still need hot air on top on the desired
+component. Or are you planning on removing all the componets? My hot
+plate is set to just below the temperature that the solder will flow.
+A quic k blast of hot air to remove the component.
*****

I have used a hot plate exclusively. No hot air assist. There is no
problem with the reheat. The board is on the hot plate and off in one
to two minutes max. I have even reflowed BGA chips with little
difficulty and no loss of reliability.

james