TenTec used hot melt glue in the VCO modules of the Paragon transceiver, so
this glue probably has good RF characteristics (hopefully). The expansion
and contraction of this glue over varying temperatures did cause the solder
joints to fracture over the years............this was the downfall of the
Paragon.
I have used epoxy over the years, with good results. That is the direction I
would go.

Pete

"MarkAren" wrote in message
...
Hi All,

Has anyone attempted to use good old fashioned hot melt glue as an
encapsulant for modules ?

Probably needs melting in a pot over a flame (with appropriate care).

A mould could me made out of Plexiglass with appropriate draft
(angles) and high temperature release agent.

A second thought is to use standard two part fiberglass mix, obviously
a lot more rigid, but potting boxes are likely to be needed also.

I guess I could use thin walled pipe to house a long rectifier stack
and associated capacitors.

Both of these options seem significantly less expensive than standard
epoxy potting compound...

Any thoughts ?

Mark