I just got in some of the SMT version of the D44H11 and D45H11 -- MJD44H11's
from ON-Semi -- in a 369A-13 type case. While I created a chip outline in
my CAD program to accomodate the new pad outlines, I am perplexed at how to
actually heat-sink and mount them -- the devices on the AavidThermalloy web
page would seem to require a cutout and pair of slots in the PCB AND a "heat
spreader" so that the device rests flat with the board and that the Emitter
and Base come into contact with the pads and align with the PCB.

Can anyone point me in the right direction for assembly? Looks like the
usual suspects (Mouser) carry D-PAK heat sinks which would work, but I'd
like a bit more information.